Job Details

Job Summary

Performs basic and routine electronic assembly operations on components or subassemblies. Perform Die Attach, Wire bond, Epoxy Dispense, Flip chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach.

Job Responsibility

• Technical knowledge of Die Attach, Wire bond, Epoxy Dispense, flip Chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach
• This position will be required to set up and run K&S ICONN Wire bonders, XYZ-Tec, and West Bond wire pull equipment. In addition, you will set up and run Besi Datacon 2200, Yamaha Chip Shooter, and EKRA printers.
• Clean PCB's and assemblies throughout process and after completion Maintain logs and paperwork and forms accurately consistent with company policy and practices.
• Must continuously meet/exceed production schedules and deadlines according to quality standards
• Other duties as assigned
• Performs a wide variety of electrical/mechanical product assembly operations on assemblies.
• Prepares assembly work to be accomplished by studying assembly instructions and following blueprint specifications.
• Using assembly drawings and related paperwork (Router, Pick List, bill of materials) to accompany parts through production flow
• Using written instructions to assemble, modify, rework, or reassemble units
• Performs basic and routine electronic assembly operations on components or subassemblies
• Maintains daily records and periodically summarizes activities
• May occasionally be required to work overtime
• Interface with Engineers and Program Managers
• Ability to operate and multi-task between 2 to 3 machines
• Knowledge of the scope of equipment is inherent in this position
• Process transactions on the Oracle (ERP) system

Required Qualification

• Knowledge of the scope of equipment is inherent in this position
• Using written instructions to assemble, modify, rework, or reassemble units
• Must continuously meet/exceed production schedules and deadlines according to quality standards
• Interface with Engineers and Program Managers
• Ability to operate and multitask between 2 to 3 machines
• Maintains daily records and periodically summarizes activities
• May occasionally be required to work overtime
• Hand and eye coordination

Preferred Qualification

• This position will be required to set up and run K&S ICONN Wire bonders, XYZ-Tec, and West Bond wire pull equipment. In addition, you will set up and run Besi Datacon 2200 Die Attach machines, Yamaha Chip Shooter, Asymtek epoxy dispense, and EKRA printers.
• Technical Knowledge of Die Attach, Wire bond, Epoxy Dispense, flip Chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach

This position requires you to access information that is subject to U.S. export regulations. You may only access such information if you are a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. government.